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Boron nitride thermal paste SilBoN

Technical Data Sheet

Basic features

Boron nitride thermal paste SilBoN promotes heat transfer away from electrical/electronic components and into heat sinks. The product provides an outstanding thermal conductivity with an exceptional dielectric properties, as well as no creep or migration over a wide temperature range. The paste contains an efficient heat conducting filler enhancing the effectiveness of heat sinks on electrical/electronic equipment.

Advantages

  • Noncorrosive
  • High dielectric strength
  • Stable from -75°C to 250°C
  • Nonflammable
  • Economical consumption
  • Easy to use

Application

  • Effective thermal coupler for heat sink device
  • Nonflammable Protective Coating
  • High voltage corona protection
  • Contact type thermocouples

Specification

FeatureValue
AppearanceWhite paste
Dielectric Constant 3
Density g/cm3 1,5
Operating temperature, °C 75 to 250
Thermal Conductivity, W/m°K1,85
Shelf life, years5

Recommendations for use

  • For industrial use only. Consult SDS before use
  • Apply the paste directly to surface or use the application tip
  • Remove cap from syringe and gently depress the plunger
  • Spread the material in a thin layer on all mounting and threaded surfaces Package: 2 g syringe Storage and safety Store in a dry place, avoid freezing. The minimum shelf life under proper cond

Storage and safety

Store in a dry place, avoid freezing. The minimum shelf life under proper conditions and unopened original packaging 5 years

Package: 2 g syringe

Products Applications